Introduction
The rapid evolution of technology has triggered a surge in the demand for cost-effective electronic products, creating an unprecedented need for high-volume manufacturing. Manufacturers must enhance their processes and speed up production timelines to meet the rapid growth demand for electronic devices. Consequently, the in-circuit testing processes applied to these products must also adapt and align with these dynamic industry demands.
This blog addresses the challenges manufacturers encounter in high-volume printed circuit board assembly (PCBA) testing and how innovative technologies are reshaping the landscape of electronics manufacturing. Outlined are the key elements contributing to a change in thinking in PCBA testing by exploring cutting-edge methodologies, sophisticated testing equipment, and streamlined processes. Embracing these advancements promises improved throughput, timesaving, work efficiency, product quality, and output.
Challenges in Conventional Test Approaches
In recent years, there has been a significant increase in demand for high-volume production of low-complexity printed circuit boards (PCBs). As a result, manufacturing processes must be streamlined by improving production times.
The conventional testing protocol for such boards typically involves multiple test stations, encompassing in-circuit tests (ICTs), flash programming, and functional testing. However, this methodology is unsuitable for high-volume production due to its constraints on test throughput and the high costs associated with multiple test stations.
Navigating High-Volume Manufacturing: Industry Approaches and Solution
One way to overcome testing challenges for high-volume manufacturing of low-complexity boards is to adopt the PCB panelization manufacturing technique. Using highly panelized boards has become a common technique in manufacturing, improving throughput and increasing production volumes. Low-cost electronics are also usually smaller and lower in complexity, so multiples of these types of boards can fit into a panel of manageable size.
In PCB panelization, manufacturers create one board from several boards and assemble them to form a single array. This technique involves fitting these smaller and less complex boards into a panel of manageable size, making it more cost-effective to move them through the assembly line.
The boards that make up the panel enable operators to load just one panel to test all boards simultaneously. During the breakout process following assembly, the panel divides into separate PCBs, a procedure known as depanelization. The individual boards can be readily depanelized or separated from the array for packaging or installation into products.
Panelizing PCBs not only assists smaller boards in conforming to standard production procedures but also enhances production efficiency. Some advantages of PCB panelization include saving time and money, improving work efficiency, enhancing product quality, and increasing output.
How does parallel panel testing improve testing throughput?
High-volume, low-complexity PCBA testing requires a test system that can conduct ICT, flash programming, and functional testing to keep up with high production volumes.
In traditional setups, in-circuit testers typically limit testing to up to four boards simultaneously. However, in high-volume manufacturing scenarios, where efficiency and throughput are paramount, the demand rises for the ability to test a larger quantity of boards in parallel. In-circuit testers must be capable of testing 10 to 20 boards in parallel to meet these demands.
Given their simpler and smaller board designs, low-complexity products can accommodate 20 boards on a single manageable-sized panel. In-circuit testers capable of massively parallel testing are with test cores to execute tests for all boards in the panel in parallel. This approach integrates multiple testers into one unified system.
Furthermore, massively parallel testing can lead to an increase in the density of panel testing. Parallel tests a greater number of boards simultaneously on a single panel. Consequently, there is a reduction in the requirement for additional fixtures, test operators, and floor space, resulting in cost savings and enhanced production scalability. Overall, massively parallel testing provides advantages over standard parallel testing, especially in the realm of high-volume manufacturing.
Table 1 shows the benchmark conducted on individual boards, panels of four, and panels of six, demonstrating that throughput increases as the number of units on a panel grows. Parallel testing attributes this outcome to the simultaneous testing of multiple units, consequently reducing overall testing time.
Table 1. PCBA test time for sequential versus parallel test
In contrast, sequential testing, which assesses one unit at a time, inherently operates more slowly due to the requirement of completing each test before starting the next. This sequential approach leads to bottlenecks within the testing process, consequently impeding the overall testing rate. However, by implementing parallel testing, where we assess multiple units simultaneously, we reduce the time needed to test each unit. This advancement substantially increases testing throughput and efficiency, streamlining the testing process.
Keysight Technologies has leveraged cutting-edge design methodologies to enable massively parallel board testing through our revolutionary Keysight i7090 massively parallel in-circuit test systems. In addition to enabling massively parallel in-circuit testing, we have extended this capability to encompass programming in a massively parallel fashion. This groundbreaking innovation eliminates manufacturers’ need to invest excessively in multiple testers. As a result, manufacturers can seamlessly integrate in-circuit testing even into their low-complexity product lines, guaranteeing receiving top-tier quality products.
Conclusion
To optimize the testing process for high-volume, low-complexity manufacturing of printed circuit board assemblies (PCBAs), a panelization technique is employed alongside a parallel test system. This method facilitates the integration of smaller, less intricate boards into manageable panel sizes, enhancing cost-effectiveness while notably reducing loading and test times. Moreover, the implementation of massively parallel testing allows operators to simultaneously test multiple boards, ensuring swift test throughput, streamlined functional test measurements, and a cost-effective approach to overcoming the challenges associated with high-volume manufacturing of less complex boards. Massively parallel testing emerges as the quintessential solution for high-volume board test production environments, delivering prompt and dependable test results.
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